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smt贴片检验标准

Release Time:2020-11-09 Edit the author:金致卓 Reading:3749

   本文关于SMT贴片加gong工艺检验标准,以下是详细内容:


  一、SMT贴片锡膏工艺

  1.PCB板上印刷的喷锡的位置与焊盘居中,无ming显的偏移,不可影响SMT元件粘贴与上锡效guo。


  2.PCB板上印刷喷锡量适中,不能完整的覆盖焊盘,少锡、漏刷。


  3.PCB板上印刷喷锡点成形不良,印刷喷锡连锡、喷锡成凹凸不平状,喷锡移位超焊盘三分之一。


  二、SMT贴片红胶工艺

  1.印刷红胶的位置居中,无ming显的偏移,不可以影响粘贴与焊锡。


  2.印刷红胶胶量适中,能良好的粘贴,无欠胶。


  3.印刷红胶胶点偏移两焊盘中间,可能造成元件与焊盘不易上锡。


  4.印刷红胶量过多,从元件体侧下面渗出的胶的宽度大于元件体宽的二分之一。


  三、SMT贴片工艺

  1、SMT元器件贴装需整齐、正中,无偏移、歪斜。


  2、SMT元器件贴装位置的元器件型号规格应正确,元器件应反面。元器件贴反(不允许元件有区别的相对称的两个面互换位置,如:有丝印标识的面与无丝印标识的面上下颠倒面),功能无法实现。


  3、有极性要求的贴片元器件贴装需按正确的极性标示加工。器件极性贴反、错误(二极管、三极管、钽质电容)。


  4、多引脚器件或相邻元件焊盘应无连锡、桥接短路。


  5.多引脚器件或相邻元件焊盘上应无残留的锡珠、锡渣。

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