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PCBA贴片在焊接之前的哪些因素会有影响?

Release Time:2021-11-10 Edit the author:金致卓 Reading:6645

PCBA贴片的生产进行加工中在回流焊阶段可以采用不同温度变化曲线的预热对于焊接工作质量的提升是有显著影响效果的。下面给大家一个简单介绍一下回流焊前的预热都有什么效果。

再流焊温度曲线的设置直接影响到PCBA贴片的质量。回流焊前缓慢加热和预热有助于活化助焊剂,防止热震,提高焊点质量。

回流焊的预热阶段起着将整个PCBA组件的温度从室温稳定升高到低于焊膏熔点(通常接近150摄氏度)的保持温度,并调节温度变化以保持每秒几度的恒定斜率的作用。SMT加工的回流预热阶段完成后,就是均热阶段,会保持一段时间的温度,保证板材受热均匀。然后回流阶段开始形成焊点。在预热和浸泡阶段,焊膏中的挥发性溶剂被烧掉,焊剂被激活。

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