Wearable devices drive demand for FPC Day PCB manufacturers push new products

After the launch of Google Glass, the electronics industry is optimistic about the future of wearable devices, and it is regarded as the next smart phone-like product. The electronic parts factory also follows the launch of various related parts, especially the flexible shape that can be adjusted according to the shape of the body. The components were exhibited at the JPCA Show 2014.

Among the flexible electronic components, the most important one is the flexible substrate (FPC), which is not only suitable for the bending part of the frame of the glasses, but also can be used in the hard substrate connection in the machine to reduce the footprint of the substrate. This makes the internal design of the machine easier to arrange; if the circuit density of the flexible substrate itself can be improved, it will be more advantageous, and the cable can be omitted.

CMK of Japan has introduced a hybrid substrate that combines a rigid substrate and a flexible substrate. It does not require designing and reserving two kinds of substrates or substrates and cables on the substrate, further saving space and providing greater design flexibility. .

Panasonic cooperated with Sankyo Kasei, an electronic parts plastics material factory, to exhibit 3D-MID technology for 3D processing on the surface of the resin, which greatly increased the circuit density of the flexible substrate.

However, there are some technical problems in the flexible substrate. For example, the part of the soldering point cannot be touched during the deflection, so as to prevent the solder material from breaking or even the solder joint falling off; and if the frame of the glasses is bent, the substrate may be exposed and oxidized. Or scratching, affecting product reliability, especially as the rain is difficult to avoid as the lens, the damage to the substrate and the entire wearable equipment.

Tamura has introduced a new welding consumable that allows the weld to be cracked once and bends. It can withstand more than 20 bends. The related materials were originally developed for automotive components, and the defense is high temperature and vibration. It can also be applied to wearable devices after improvement, and will continue to improve the softness of materials in the future, further reducing the possibility of bending damage.

Nippon Mektron's technology is based on silicone coated flexible circuit boards to protect the board from water or other chemicals. The substrate coating film can be directly applied to the wearable casing by mixing and distributing the heat-transfer resin with a certain component to maintain softness and thermal conductivity.